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Freescale Semiconductor Technical Data
MRFIC1505 Rev. 1, 08/2004
MRFIC1505/MRFIC1505A Integrated GPS Downconverter
1.575 GHz GPS DOWNCONVERTER
This integrated circuit is intended for GPS receiver applications. The dual conversion design is implemented in Motorola's low-cost, high-performance MOSAIC 5. silicon bipolar process and is packaged in a low-cost surface mount LQFP-48 package. In addition to the mixers, a VCO, PLL, Crystal Oscillator, A/D converter and a loop filter are integrated on-chip. Output IF is nominally 4.1 MHz. * 105 dB Typical Conversion Gain * 2.7 V Operation * 28 mA Typical Current Consumption * Low-Cost, Low-Profile Plastic LQFP Package MOSAIC 5 is a trademark of Motorola, Inc.
Ordering Information
Device MRFIC1505R2 MRFIC1505AR2 Operating Temperature Range TA = -40 to 85C TA = -40 to 85C Package LQFP-48 LQFP-48 Plastic Package Case 932 (LQFP-48)
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
Maximum Ratings
Rating DC Supply Voltage DC Supply Current Operating Ambient Temperature Storage Temperature Range Lead Soldering Temperature Range Symbol VDD IDD TA Tstg - Value 5.0 60 -40 to 85 -65 to 150 260 Unit Vdc mA C C C
Note: Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables.
Electrical Characteristics (VCC = 2.7 to 3.3 V; TA = -40 to 85C; Enable = 2.7 V unless otherwise noted)
Characteristic Total Device Supply Voltage Supply Current (TA = 25C, VCC = 2.7 V, Enable = 2.7V) Supply Current (TA = 25C, VCC = 2.7 V, Enable = 2.7V) RF Amplifier RF Input Frequency Input Impedance Input VSWR Gain Noise Figure 1.0 dB Compression (Measured at Output) First Mixer Input Frequency Gain Noise Figure 1.0 dB compression (Measured at Output) First Local Oscillator Frequency First Intermediate Frequenc LO Leakage at IF Port LO Leakage at RF Port Output Impedance First IF Amplifier and Second Mixer Input Frequency Input Impedance Output Impedance Second Local Oscillator Frequency Second Intermediate Frequency LO Leakage at IF Port Gain Cascaded Noise Figure 1.0 dB Compression Point (Measured at Output) Limiting Amplifier Second Intermediate Frequency Input Signal Level Output Voltage Swing (into 10 pf ll100 k DC Output Level Gain Reference Oscillator Reference Frequency Reference Frequency Input Level (Crystal Output Pin) Symbol VCC ICC ICC fin Zin VSWRin G NF P1dB fin G NF P1dB fLO1 fIF1 - - Zout fin Zin Zout fLO2 fIF2 - G NF P1dB fIF2 - Vout - G fr - Min 2.7 - - Typ 3.0 28 2.0 Max 3.3 36 4.0 Unit V mA mA
- - - 13 - - - 10 - - - - - - - - - - - - - 40 - - - 4.0 800 - - - -
1575.42 50 2.0 15 2.0 1.0 1575.42 14 13 -13 1636.8 61.38 -40 -50 50 61.38 230 50 65.47 4.092 -40 43 9.3 -13 4.092 11 - 1.4 50 16.368 500
- - - - - - - - - - - - - - - - - - - - - - - - - 31 - - - - -
MHz - dB dB dBm MHz dB dB dBm MHz MHz dBm dBm MHz MHz MHz dBm dB dB dBm MHz Mv mVpp V dB MHz mVpp
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Freescale Semiconductor
Electrical Characteristics (VCC = 2.7 to 3.3 V; TA = -40 to 85C; Enable = 2.7 V unless otherwise noted)
Characteristic Reference Oscillator Output Voltage Level (Into 15 pf II 10 k) Reference Clock Input Drive Level PLL First Local Oscillator Frequency Second Local Oscillator Frequency VCO C/N (at 10 kHz Offset) VCO Gain (TBD Varactor) Enable Enable Active Level Disable Active Level Voltage Regulator Regulator Output Voltage (VCC = 2.7 to 3.3 V, Iout = 3.0 mA) MRFIC505 Temperature Sense Specs Temperature Sensor Output Voltage @ 25C Temperature Sensor Slope over Temperature MRFIC505A Temperature Sense Specs Temperature Sensor Output Voltage @ 25C Temperature Sensor Slope over Temperature Symbol - - fLO1 fLO2 - - - - Min 750 400 - - - - 0.8 x VCC - Typ - 800 1636.8 65.47 -80 200 VCC 0 Max - 1500 - - - - - 0.2 x VCC 2.5 Unit mVpp mVpp MHz MHz dBc/Hz MHz/V V V
VO - - - -
2.1
2.3
V
1.2 - 1.270 -
1.28 5.0 1.395 5.0
1.375 - 1.463 -
V mV/C V mV/C
Freescale Semiconductor
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Figure 1 Applications Schematic (1636.8 MHz LO)
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Outline Dimensions
PLASTIC PACKAGE CASE 932-03 (LQFP-48) ISSUE F
4X
0.200 AB T-U Z 9 A1
48 37
A
DETAIL Y
P
1
36
T B B1
12 25
U V AE V1 AE
NOTES: 1 DIMENSIONING AND TOLERANCING PER ASME 3 CONTROLLING DIMENSION: MILLIMETER. 2 DATUM PLANE AB IS LOCATED AT BOTTOM OF Y14.5M, 1994. LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT 4 DATUMS T, U, ANDTHE PARTING LINE. THE BOTTOM OF Z TO BE DETERMINED AT 5 DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE AB. 6 DIMENSIONS A AND B DO NOT INCLUDE MOLD SEATING PLANE AC. PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE 7 DIMENSION D DOES NOTPLANE AB.DAMBAR DETERMINED AT DATUM INCLUDE PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 8 MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.350. 9 EXACT SHAPE OF EACH CORNER IS OPTIONAL. 0.0076.
13
24
Z S1 S
4X
T, U, Z DETAIL Y
0.200 AC T-U
Z
AB
G
0.080 AC
AD AC
BASE METAL
DIM A A1 B B1 C D E F G H J K L M N P R S S1 V V1 W AA
MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 0 _ 7 _ 12 _ REF 0.090 0.160 0.250 BSC 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF
M _
TOP & BOTTOM
R
GAUGE PLANE
N
J C E
0.250
F D 0.080
M
AC T-U Z H DETAIL AD AA W L _ K
SECTION AE-AE
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NOTES
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NOTES
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FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2004. All rights reserved. MRFIC1505 Rev. 1 08/2004

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